| 发明名称 |
Electronic component with electronic chip between redistribution structure and mounting structure |
| 摘要 |
An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery, wherein at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure comprises electrically conductive inserts in an electrically insulating matrix. |
| 申请公布号 |
US2015145111(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201314087070 |
申请日期 |
2013.11.22 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
MENGEL Manfred;Fuergut Edward;Otremba Ralf;Hoegerl Juergen |
| 分类号 |
H01L25/16;H01L25/00;H01L23/528;H01L23/31;H01L23/495;H01L21/56;H01L25/07 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, the electronic component comprising:
an electrically conductive mounting structure; an electronic chip on the mounting structure; an electrically conductive redistribution structure on the electronic chip; a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery. |
| 地址 |
Villach AT |
