| 摘要 |
A piezoelectric oscillator includes a piezoelectric vibrating piece, an integrated circuit, and a package. The package includes a first layer, a second layer, a third layer, and a fourth layer. The ceiling surface as a portion of the inferior surface of the third layer has a rectangular shape surrounded by short sides and long sides. The ceiling surface includes a pair of frequency checking terminals electrically connected to the connecting electrodes and control terminals to control the integrated circuit. The pair of the frequency checking terminal are adjacent to one another. The respective frequency checking terminals are disposed in contact with any of the long sides and one of the short sides. The control terminals are extracted to the top surface of the third layer, and overlap the frequency checking terminals in a vertical direction on the top surface of the third layer to be connected to the mounting terminals. |
| 主权项 |
1. A piezoelectric oscillator, comprising:
a piezoelectric vibrating piece having a flat rectangular shape, the piezoelectric vibrating piece including a pair of excitation electrodes and a pair of extraction electrodes disposed on principal surfaces of the piezoelectric vibrating piece, each of the extraction electrodes being extracted from each of the excitation electrodes to one side of the flat rectangular shape; an integrated circuit configured to cause the piezoelectric vibrating piece to oscillate at a predetermined frequency; and a package having a first space where the piezoelectric vibrating piece is placed, and a second space where the integrated circuit device is placed, wherein the package includes: a first layer forming a side surface of the first space; a second layer disposed on an inferior surface of the first layer to form a bottom surface of the first space, a pair of connecting electrodes are disposed on the bottom surface, the pair of connecting electrodes being electrically connected to the respective extraction electrodes of the piezoelectric vibrating piece; a third layer disposed on the inferior surface of the second layer to form a ceiling surface of the second space, the integrated circuit being placed on the ceiling surface; and a fourth layer disposed on the inferior surface of the third layer to form a side surface of the second space, a plurality of mounting terminals are disposed on the inferior surface, the ceiling surface of the second space as a portion of the inferior surface of the third layer has a rectangular shape surrounded by short sides and long sides, the ceiling surface including a pair of frequency checking terminals electrically connected to the connecting electrodes and control terminals to control the integrated circuit, the pair of the frequency checking terminals are adjacent to one another, the respective frequency checking terminals being disposed in contact with any of the long sides and one of the short sides, and the control terminals are extracted to the top surface of the third layer, and then overlap the frequency checking terminals in a vertical direction on the top surface of the third layer to be connected to the mounting terminals. |
