| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized electro/mechanical microchip that utilizes new techniques and materials that simplify work and greatly reduce cost down to a disposable level.SOLUTION: A method for making an electromechanical chip using a plurality of transparent substrates comprises the steps of: machining, using photoacoustic compression processing, full or partial voids in at least one of the plurality of transparent substrates; and, after stacking and arranging the plurality of transparent substrates in specific order, bonding the transparent substrates together and sealing them by laser welding or adhesive. |
