| 摘要 |
[Problem] To provide an electronic component storage package, etc., allowing reduction of the time of a heating process using infrared radiation. [Solution] An electronic component storage package (10) provided with an insulating substrate (1) including a plurality of interlayered insulating layers (11), and having a top surface that includes a part for mounting the electronic component (4), wherein each of the plurality of insulating layers (11) of the insulating substrate contains as a main component a first metal oxide, and on the top surface of the uppermost insulating layer (11) is further provided a first metal layer (2) provided in a frame shape, the first metal layer (2) containing a second metal oxide having a higher infrared absorption rate than the first metal oxide. |
