发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND RINSING FLUID |
摘要 |
The invention provides a method for manufacturing a semiconductor device. The method includes: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition for a semiconductor being 10 ppb by mass or less on an elemental basis, and the semiconductor substrate being provided with an interlayer insulating layer having the recess portion and a copper-containing wiring of which at least a part thereof is exposed on at least a part of the bottom face of the recess portion; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment under a temperature condition of from 200°C to 425°C, to remove at least a part of the sealing layer that has been formed on an exposed face of the wiring. |
申请公布号 |
EP2876675(A1) |
申请公布日期 |
2015.05.27 |
申请号 |
EP20130819549 |
申请日期 |
2013.07.12 |
申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
ONO, SHOKO;KAYABA, YASUHISA;TANAKA, HIROFUMI;KOHMURA, KAZUO;SUZUKI, TSUNEJI |
分类号 |
H01L21/3105;C08G73/02;C09D179/02;H01L21/311;H01L21/312;H01L21/768 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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