发明名称 |
Sputtering target |
摘要 |
A sputtering target including a sintered body including In, Ga and Mg,
the sintered body including one or more compounds selected from a compound represented by In2O3, a compound represented by In(GaMg)O4, a compound represented by Ga2MgO4 and a compound represented by In2MgO4, andhaving an atomic ratio In/(In+Ga+Mg) of 0.5 or more and 0.9999 or less and an atomic ratio (Ga+Mg)/(In+Ga+Mg) of 0.0001 or more and 0.5 or less. |
申请公布号 |
US9039944(B2) |
申请公布日期 |
2015.05.26 |
申请号 |
US201214130857 |
申请日期 |
2012.06.28 |
申请人 |
IDEMITSU KOSAN CO., LTD. |
发明人 |
Ebata Kazuaki;Tomai Shigekazu;Terai Kota;Matsuzaki Shigeo;Yano Koki |
分类号 |
H01L21/283;H01L29/788;C23C14/08;C23C14/34;H01L21/02;C01G15/00;H01B1/08;H01L29/786;C04B35/01;C04B35/626;H01L27/12 |
主分类号 |
H01L21/283 |
代理机构 |
Foley & Lardner LLP |
代理人 |
Foley & Lardner LLP |
主权项 |
1. A sputtering target comprising a sintered body comprising In, Ga and Mg,
the sintered body comprising a compound redresented by In2O3, the sintered body comprising one or more compounds selected from a compound represented by In(GaMg)O4, a compound represented by Ga2MgO4 and a compound represented by In2MgO4, and having an atomic ratio In/(In+Ga+Mg) of 0.5 or more and 0.9999 or less and an atomic ratio (Ga+Mg)/(In+Ga+Mg) of 0.0001 or more and 0.5 or less. |
地址 |
Tokyo JP |