发明名称 Sputtering target
摘要 A sputtering target including a sintered body including In, Ga and Mg, the sintered body including one or more compounds selected from a compound represented by In2O3, a compound represented by In(GaMg)O4, a compound represented by Ga2MgO4 and a compound represented by In2MgO4, andhaving an atomic ratio In/(In+Ga+Mg) of 0.5 or more and 0.9999 or less and an atomic ratio (Ga+Mg)/(In+Ga+Mg) of 0.0001 or more and 0.5 or less.
申请公布号 US9039944(B2) 申请公布日期 2015.05.26
申请号 US201214130857 申请日期 2012.06.28
申请人 IDEMITSU KOSAN CO., LTD. 发明人 Ebata Kazuaki;Tomai Shigekazu;Terai Kota;Matsuzaki Shigeo;Yano Koki
分类号 H01L21/283;H01L29/788;C23C14/08;C23C14/34;H01L21/02;C01G15/00;H01B1/08;H01L29/786;C04B35/01;C04B35/626;H01L27/12 主分类号 H01L21/283
代理机构 Foley & Lardner LLP 代理人 Foley & Lardner LLP
主权项 1. A sputtering target comprising a sintered body comprising In, Ga and Mg, the sintered body comprising a compound redresented by In2O3, the sintered body comprising one or more compounds selected from a compound represented by In(GaMg)O4, a compound represented by Ga2MgO4 and a compound represented by In2MgO4, and having an atomic ratio In/(In+Ga+Mg) of 0.5 or more and 0.9999 or less and an atomic ratio (Ga+Mg)/(In+Ga+Mg) of 0.0001 or more and 0.5 or less.
地址 Tokyo JP