发明名称 Flexible Printed Wiring Board and Electronic Apparatus
摘要 According to one embodiment, a flexible printed wiring board includes a first conductor layer formed on the first surface of an insulation base, a second conductor layer formed on the second surface of the insulation base, a first insulation layer covering the first conductor layer, and a second insulation layer covering the second conductor layer. The first insulation layer has an opening formed in a position corresponding to a connecting terminal portion to expose the first conductor layer. A metal layer is provided in a region ranging from the connecting terminal portion to a bending presumed portion. The metal layer is positioned behind the opening between the second surface and the second insulation layer to avoid the first conductor layer.
申请公布号 US2015136448(A1) 申请公布日期 2015.05.21
申请号 US201414459134 申请日期 2014.08.13
申请人 Kabushiki Kaisha Toshiba 发明人 Sasaki Kazuyoshi
分类号 H05K1/02;H05K1/11 主分类号 H05K1/02
代理机构 代理人
主权项 1. A flexible printed wiring board including a connecting terminal portion connected to a connector, and a bending presumed portion continuously extending from the connecting terminal portion, comprising: an insulation base including a first surface and a second surface as a back surface; a first conductor layer formed on the first surface of the insulation base; a second conductor layer formed on the second surface of the insulation base; a first insulation layer formed on the first surface of the insulation base to cover the first conductor layer, and having an opening formed in a position corresponding to the connecting terminal portion to expose the first conductor layer; a second insulation layer formed on the second surface of the insulation base to cover the second conductor layer; and a metal layer provided in a region ranging from the connecting terminal portion to the bending presumed portion, the metal layer being positioned behind the opening between the second surface of the insulation base and the second insulation layer to avoid the first conductor layer exposed through the opening.
地址 Tokyo JP