| 摘要 |
Connection bridges (CBR, 210/212) for dual-interface transponder chip modules (TCM) 200 may have an area which is at least25% of,substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA, 202). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC). |
