| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin sheet capable of recognizing an arrangement position of an electronic component even after various kinds of electronic components are sealed, and to provide a method of manufacturing an electronic component package using the same.SOLUTION: Disclosed is a sealing resin sheet in which a directed shaped part is provided at least at one place on the peripheral edge in a plan view. It is preferable that the directed shaped part is a recess, a protrusion, or a chamfer. It is preferable that a planar view shape of the sealing resin sheet is a rectangle. When the planar view shape of the sealing resin sheet is the rectangle, it is preferable that the chamfer is provided at the corner of the rectangle. |
