COOLING STRUCTURE FOR PORTABLE ELECTRONIC DEVICE

摘要

The invention is a cooling structure for a portable electronic device wherein a case (1) having a sealed structure houses therein a substrate (6) whereon a heat-generating component (7) that generates heat by being in operation is mounted, and wherein a radiator plate (4) is provided for radiating the heat from the heat-generating component (7) to a location distant from the heat-generating component. In the cooling structure, the radiator plate (4) is integrated with the internal surface of the part of the case (1) corresponding to a face plate or the internal surface of the part of the case (1) corresponding to a back plate (3), and a flat heat pipe (5) crushed and flattened in the thickness direction of the case (1) is disposed in such a way that one extremity thereof is sandwiched between the heat-generating component (7) and the radiator plate (4), and the other extremity is in tight contact with the radiator plate (4).