| 摘要 |
The present invention discloses a solder ball re-balling device which supplies solder balls to a ball pad for various ball grid array (BGA) type printed circuit boards (high precision electronic parts) when reusing a BGA circuit board due to a defect or the like, and comprises a lower body to support and fix the BGA circuit board and an upper cover which supplies the solder balls to pores of a metal mask by detachably placing the metal mask to precisely mount and fix the solder balls using a flux having a fixed viscosity. The solder ball re-balling device fixes a BGA package by using a shaft drive control means disposed on the lower body, and aligns the metal mask with the BGA package on a metal mask fixing unit. The solder ball re-balling device compensates for problems of a complex structure and user inconvenience inherent in a conventional solder ball re-balling device having an XYZ-axis multi-axial combination shaft drive control means and problems associated with misalignment in an automatic centering solder ball re-balling device when performing a centering function to adjust a distance by rotation with a single operation on a circuit board having a different width. The solder ball - device according to the present invention can align a BGA package of any size on a single mounting unit with a simple, easy relative position adjustment. |
