| 摘要 |
New and useful blends of thermosetting resins with copolymers of certain amounts of ethylene with another monomer copolymerizable therewith to provide solid but flexible polymers, and a third monomer containing epoxy side groups, and optionally carbon monoxide, are provided. These blends result in performance unattainable with the thermosetting resin alone in terms of flexibility, toughness, and adhesion. Such blends may be used, for example, to produce flexible, semirigid or rigid films, coatings, fibers, foams or molded articles.
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