| 摘要 |
According to an embodiment, provided is a light emitting device package comprising: a body in which cavities are formed on a first lead frame and a second lead frame which are separated each other; an encapsulating material filled in the cavities; a first light emitting device arranged on the first lead frame; and a second light emitting device separated with the first light emitting device and arranged in the encapsulating material, wherein at least one area of the second light emitting device is arranged to be overlapped with the first light emitting device. |
