发明名称 |
WAFER BONDER, WAFER BONDING APPRATUS, AND WAFER BONDING METHEOD USING PLASMA ACTIVATION PROCESS |
摘要 |
A wafer bonding apparatus according to an aspect of the present invention includes a support unit for holding a first wafer, a vacuum holder which supports a second wafer facing the first wafer and forms a vacuum pressure. The vacuum holder includes decompression holes which are separated in the diameter direction of the wafer. Different vacuum pressures can be applied to the decompression hole. |
申请公布号 |
KR101521971(B1) |
申请公布日期 |
2015.05.20 |
申请号 |
KR20130154144 |
申请日期 |
2013.12.11 |
申请人 |
HUTEM CO., LTD. |
发明人 |
SHIN, HONG SOO;DO, HYUN JUNG;KIM, JIN WON |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|