发明名称 WAFER BONDER, WAFER BONDING APPRATUS, AND WAFER BONDING METHEOD USING PLASMA ACTIVATION PROCESS
摘要 A wafer bonding apparatus according to an aspect of the present invention includes a support unit for holding a first wafer, a vacuum holder which supports a second wafer facing the first wafer and forms a vacuum pressure. The vacuum holder includes decompression holes which are separated in the diameter direction of the wafer. Different vacuum pressures can be applied to the decompression hole.
申请公布号 KR101521971(B1) 申请公布日期 2015.05.20
申请号 KR20130154144 申请日期 2013.12.11
申请人 HUTEM CO., LTD. 发明人 SHIN, HONG SOO;DO, HYUN JUNG;KIM, JIN WON
分类号 H01L21/20 主分类号 H01L21/20
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