| 摘要 |
<p>The present invention provides an electronic component installing device and an electronic component installing method capable of shortening installing time for taking out a qualified bare chip from a wafer and installing the bare chip on a substrate. The electronic component installing device obtains position information of the each bare chip according to an integral image of the wafer, obtains qualified information of the each bare chip, then obtains position information of the qualified bare chip according to the position information and the qualified information of the each bare chip, and takes out the qualified bare chip from the wafer to install on the substrate based on the obtained position information of the qualified bare chip. Therefore, there is no need to take photos for the each bare chip like now, and the installing time for taking out the qualified bare chip from the wafer and installing the bare chip on the substrate can be shortened.</p> |
