| 摘要 |
<p>Provided is a lead-free solder alloy which makes possible lower soldering temperatures and improves the reliability of the soldered joint, and a solder paste and packaged components using the lead-free solder alloy. The lead-free solder alloy comprises 0.07~7.0 mass % Cu, 0.05 mass %~5.0 mass % Bi, 0.05~5.0 mass % Sb, 0.001~0.1 mass % Fe, 0.01~1.0 mass % of at least one metal selected from among Ni and Co, and 3.0 mass % or less of Ag, with the remainder being Sn, wherein the ratio between Fe and at least one metal selected from among Ni and Co (Fe / metal selected from among Ni and Co) is 0.002~5.0.</p> |
