Phase change heat sink for transient thermal management

摘要

A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.

主权项

1. A clamshell assembly for a printed circuit board (PCB) having at least one heat producing component, comprising:
an upper thermal plane defining a first portion of the clamshell; a lower thermal plane spaced from the upper thermal plane to partially define a PCB chamber for holding the PCB and defining a second portion of the clamshell; and a heat sink with a phase change material mounted to one of the upper thermal plane and the lower thermal plane; wherein the first portion and second portion of the clamshell are coupled to define a housing structure that contains the PCB.