Receiver module and device

摘要

Provided is a receiver module, including: a semiconductor light receiving element including an electrode; and a sub-mount including: an electrical wiring joined to the electrode with solder; and a trap region arranged around a joining surface of the electrical wiring, the trap region retaining solder by solder wetting.

主权项

1. A receiver module, comprising:
a semiconductor light receiving element comprising an electrode; and a sub-mount comprising:
an electrical wiring;a barrier metal disposed on a joining surface of the electrical wiring facing the electrode; andsolder disposed on a surface of the barrier metal, and the electrical wiring is joined to the electrode by the solder with the barrier metal disposed therebetween, wherein the electrical wiring has a trap region disposed around the barrier metal, and the trap region retains melted solder by solder wetting on the electrical wiring, wherein a surface area of the electrode joined to the electrical wiring is smaller than a surface area of the barrier metal.