发明名称 Trench power MOSFET structure fabrication method
摘要 A trench power MOSFET structure and fabrication method thereof is provided. The fabrication method comprises following process. First, form an isolating trench. Then, form at least two doped regions around the isolating trench. The doped regions are adjacent and the doping concentrations of two doped regions are different. Form an isolating structure in the isolating trench. Wherein, the junction profiles of the two doped regions are made by on implantation method for moderate the electric field distribution and decreasing the conduction loss.
申请公布号 US9035378(B2) 申请公布日期 2015.05.19
申请号 US201414257999 申请日期 2014.04.21
申请人 SUPER GROUP SEMICONDUCTOR CO., LTD. 发明人 Hsu Hsiu-Wen;Yeh Chun-Ying;Lee Yuan-Ming
分类号 H01L21/762;H01L29/66;H01L29/78 主分类号 H01L21/762
代理机构 CKC & PARTNERS CO., LTD. 代理人 CKC & PARTNERS CO., LTD.
主权项 1. A trench power MOSFET structure fabrication method, comprising: forming an isolating trench; forming two doped regions around the isolating trench, wherein the two doped regions are adjoining and the doping concentrations of two doped regions are different; and forming an isolating structure in the isolating trench.
地址 New Taipei TW