| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin electronic component capable of stably keeping conduction between an electronic element and an external electrode, and easily forming a through electrode.SOLUTION: A method for manufacturing an electronic component 1 in which an electronic element 30 is embedded, comprises: a through hole formation step for forming a through hole on a glass base 10; an electrode formation step for forming internal and external common electrodes as a common electrode, inside a side on which the electronic element is arranged on the base, and outside a side opposite to the side on which the electronic element is arranged, at a time; and a mounting step for electrically connecting internal and external common electrodes and the electronic element; and a bond step for bonding a cover 40 covering the electronic element to the base.</p> |
