| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of achieving reliable conduction when forming an interlayer conductive part, while preventing degradation of electric characteristics, e.g., conductivity.SOLUTION: A method of manufacturing a circuit board 1 having an interlayer conductive part 12 includes a step for forming a recess 21 in one principal surface of an insulating substrate 2 by imprinting, so as to correspond with the shape of the interlayer conductive part 12 and to leave a thin film 14 including an aperture partially on the bottom, and a step for filling the recess including an aperture with a conductor 6.</p> |
