半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

一种半导体封装件及其制法，该制法系包括：提供一其上具有剥离层之承载板，并于该剥离层上接置具有相对之作用面与非作用面的半导体晶片，该半导体晶片之作用面系面向该剥离层，且该半导体晶片之非作用面上系形成有疏水层，再于该剥离层未设有该半导体晶片之表面上形成介电层，接着，于该疏水层与介电层上覆盖封装胶体，并于该封装胶体上压合一基板，再移除该承载板与剥离层，以外露该半导体晶片之作用面。本发明能避免半导体晶片于封装过程中偏移，进而增进良率。; forming a dielectric layer on the surface of the release film layer in which the semiconductor wafer is not provided, and then covering the hydrophobic layer and the dielectric layer by a packaging encapsulant, laminating the packaging encapsulant on a substrate, and removing the carrier and the release film layer, so as to expose the acting surface of the semiconductor wafer. The present invention enables semiconductor wafer to avoid die-drifting during the packaging fabrication process, and then improves the yield.