LIQUID COOLING OF MULTIPLE COMPONENTS ON A CIRCUIT BOARD

摘要

A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

主权项

1. A method, comprising:
securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased in a direction away from the secondary cold plate while limiting the distance that the primary cold plate can move away from the secondary cold plate; aligning the secondary cold plate with a circuit board having a plurality of heat-generating components, wherein the primary cold plate is aligned with a processor on the circuit board; securing the aligned secondary cold plate to the circuit board, wherein the secondary cold plate has a first surface in thermal engagement with the plurality of heat-generating components on the circuit board, and wherein the primary cold plate is pressed against the processor to overcome the bias on the primary cold plate, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary cold plate and the secondary cold plate; and passing a cooling liquid through a liquid cooling channel within the primary cold plate, wherein the primary cold plate draws heat from the processor and from the secondary cold plate.