| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrain an adhesive layer from being peeled from an adhesive tape. <P>SOLUTION: A tape for wafer processing comprises: a peeling film; an adhesive layer 3 provided on the peeling film; an adhesive tape 4 provided to cover the adhesive layer 3 from above whose outer periphery contacts the peeling film on the outside of the adhesive layer 3. In the tape for wafer processing, the adhesive layer 3 has a main part 3a and at least one projection 3b when seen in a plan view. The projection 3b is formed in the upstream side of the peeling direction of the peeling film. When the main part 3a and the projection 3b are cut by a line L which goes through inflection points 20 and 22 between the main part 3a and the projection 3b, the ratio (X/Y) of the area of the projection 3b (X) and the area of the main part 3a (Y) which is equivalent to the length d2 that is the same length as the length d1 from the line L to the long direction of the projection 3b is no more than 0.75. <P>COPYRIGHT: (C)2012,JPO&INPIT |
