SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor module of the present invention includes: a semiconductor element having a first main surface and a second main surface facing the first main surface, the semiconductor element including a front surface electrode and a back surface electrode on the first main surface and the second main surface, respectively; a metal plate electrically connected to the back surface electrode of the semiconductor element through a sintered bonding material including metal nanoparticles; and a plate-shaped conductor electrically connected to the front surface electrode of the semiconductor element through the sintered bonding material including the metal nanoparticles. The metal plate and the conductor include grooves communicating between a bonding region bonded to the semiconductor element and the outside of the bonding region.

主权项

1. A semiconductor module, comprising:
a semiconductor element having a first main surface and a second main surface facing said first main surface, the semiconductor element including a front surface electrode and a back surface electrode on said first main surface and said second main surface, respectively; a metal plate electrically connected to said back surface electrode of said semiconductor element through a sintered bonding material including metal nanoparticles; and a plate-shaped conductor electrically connected to said front surface electrode of said semiconductor element through the sintered bonding material including the metal nanoparticles, wherein said metal plate and said conductor include a conductive path communicating between a bonding region bonded to said semiconductor element and the outside of said bonding region.