| 发明名称 |
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors. |
| 申请公布号 |
US2015131231(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414267456 |
申请日期 |
2014.05.01 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOO Do Jae;Ryu Jong In;Jo Eun Jung;Lim Jae Hyun;Oh Kyu Hwan |
| 分类号 |
H05K1/02;H05K1/11;H05K3/30;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component module, comprising:
a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors. |
| 地址 |
Suwon-Si KR |
