MOLD RELEASE FILM AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

摘要

Provided are: a mold release film wherein wrinkles and pinholes are not easily generated at the time of being adhered to a cavity surface of a molding die, even if the thickness of the mold release film is small; a mold release film whereby a resin-sealed section can be formed, said resin-sealed section not easily generating chipping and breakage in a singulation step, and having excellent adhesiveness to an ink layer; and a semiconductor package manufacturing method using the mold release film. This mold release film is to be disposed on a cavity surface of a molding die in a semiconductor package manufacturing method wherein a semiconductor element is disposed in a molding die, and a resin-sealed section is formed by sealing the semiconductor element using a curable resin. The mold release film is characterized in that: the mold release film has a first surface in contact with the curable resin at the time of forming the resin-sealed section, and a second surface in contact with the cavity surface; recesses and projections are formed in the first surface and/or the second surface; and the surface having the recesses and projections formed therein has an arithmetic average roughness (Ra) of 1.3-2.5 μm, and a peak count (RPc) of 80-200.