发明名称 |
INTERLAYER COMMUNICATIONS FOR 3D INTEGRATED CIRCUIT STACK |
摘要 |
Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules. |
申请公布号 |
US2015130534(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
US201514599245 |
申请日期 |
2015.01.16 |
申请人 |
Intel Corporation |
发明人 |
Droege Guido;Linkewitsch Niklas;Schaefer Andre |
分类号 |
H01L25/065;H01L23/48;H01L23/522 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus, comprising:
at least two integrated circuit (IC) layers including a core logic layer and one or more memory layers of different technologies; and a bus to communicatively link the at least two layers to each other, the bus including one or more interconnects connected through the at least three layers, wherein each layer includes at least one bus interface coupled to the interconnects through coupling capacitors. |
地址 |
Santa Clara CA US |