发明名称 |
Hydrogen-Free Amorphous Dielectric Insulating Thin Films With No Tunneling States |
摘要 |
A hydrogen-free amorphous dielectric insulating film having a high material density and a low density of tunneling states is provided. The film is prepared by e-beam deposition of a dielectric material on a substrate having a high substrate temperature Tsub under high vacuum and at a low deposition rate. In an exemplary embodiment, the film is amorphous silicon having a density greater than about 2.18 g/cm3 and a hydrogen content of less than about 0.1%, prepared by e-beam deposition at a rate of about 0.1 nm/sec on a substrate having Tsub=400° C. under a vacuum pressure of 1×10−8 Torr. |
申请公布号 |
US2015129089(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
US201414538968 |
申请日期 |
2014.11.12 |
申请人 |
The Government of the United States of America, as represented by the Secretary of the Navy |
发明人 |
Liu Xiao;Queen Daniel R.;Hellman Frances |
分类号 |
H01B3/02;C23C16/48;H01B19/04;C23C14/14;C23C16/06;C23C16/24;C23C14/34;C23C14/06;C22C45/00;C23C16/26 |
主分类号 |
H01B3/02 |
代理机构 |
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代理人 |
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主权项 |
1. A dielectric insulating thin film comprising an amorphous dielectric material having a mass density of at least 90% of a mass density of a crystalline counterpart of the amorphous material and having a hydrogen content of less than about 0.1%, wherein the thin film is substantially free from two-level tunneling states (TLS). |
地址 |
Washington DC US |