发明名称 Hydrogen-Free Amorphous Dielectric Insulating Thin Films With No Tunneling States
摘要 A hydrogen-free amorphous dielectric insulating film having a high material density and a low density of tunneling states is provided. The film is prepared by e-beam deposition of a dielectric material on a substrate having a high substrate temperature Tsub under high vacuum and at a low deposition rate. In an exemplary embodiment, the film is amorphous silicon having a density greater than about 2.18 g/cm3 and a hydrogen content of less than about 0.1%, prepared by e-beam deposition at a rate of about 0.1 nm/sec on a substrate having Tsub=400° C. under a vacuum pressure of 1×10−8 Torr.
申请公布号 US2015129089(A1) 申请公布日期 2015.05.14
申请号 US201414538968 申请日期 2014.11.12
申请人 The Government of the United States of America, as represented by the Secretary of the Navy 发明人 Liu Xiao;Queen Daniel R.;Hellman Frances
分类号 H01B3/02;C23C16/48;H01B19/04;C23C14/14;C23C16/06;C23C16/24;C23C14/34;C23C14/06;C22C45/00;C23C16/26 主分类号 H01B3/02
代理机构 代理人
主权项 1. A dielectric insulating thin film comprising an amorphous dielectric material having a mass density of at least 90% of a mass density of a crystalline counterpart of the amorphous material and having a hydrogen content of less than about 0.1%, wherein the thin film is substantially free from two-level tunneling states (TLS).
地址 Washington DC US