发明名称 ポリプロピレン系樹脂発泡粒子及びポリプロピレン系樹脂発泡粒子成形体
摘要 <p>An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.</p>
申请公布号 JP5717198(B2) 申请公布日期 2015.05.13
申请号 JP20120047787 申请日期 2012.03.05
申请人 发明人
分类号 C08J9/16;C08J9/228 主分类号 C08J9/16
代理机构 代理人
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