| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of miniaturization and thinning, and its manufacturing method. <P>SOLUTION: The wiring board comprises: a substrate 21 at least one of whose front face or rear face is designated as a mounting surface 21a of various components; a recessed part 26 formed on at least one side edge of the substrate 21; a connection terminal 31 extended from a side surface 26a of the recessed part 26 and bent in a direction orthogonal to the surface of the substrate 21. The connection terminal 31 is a wiring board 11 positioned inside of the side surface of the substrate 21. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
