| 摘要 |
<p>Disclosed is a radiation-sensitive resin composition which hardly dissolves into a liquid for immersion exposure with which the resin composition comes in contact during a liquid immersion exposure, and has a large receding contact angle with the liquid for immersion exposure. The radiation-sensitive resin composition can form a resist film which is capable of highly precisely forming a fine resist pattern having less development defects. The radiation-sensitive resin composition is used for formation of a resist film in a method for forming a resist pattern which comprises an immersion exposure step, and contains a resin component, an acid generator and a solvent. The resin component contains a resin (A1) which contains a repeating unit (a1) having a fluorine atom and an acid-cleavable group in a side chain. The resin composition is characterized in that the value of K1 defined by the following formula: K1 = F1/F2 (wherein F1 represents the fluorine content ratio in the outermost surface portion of the resist film, and F2 represents the fluorine content ratio in the portion from the outermost surface to the position around 20% of the thickness of the resist film) satisfies the following formula: 1 = K1 = 5.</p> |
