发明名称 |
Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate |
摘要 |
An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included. |
申请公布号 |
US9027822(B2) |
申请公布日期 |
2015.05.12 |
申请号 |
US201113822708 |
申请日期 |
2011.08.25 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Sakurai Daisuke |
分类号 |
B23K31/02;B23K35/02;B23K1/00;B23K1/20;B23K3/06;H01L21/683;H01L23/00;H05K3/34 |
主分类号 |
B23K31/02 |
代理机构 |
RatnerPrestia |
代理人 |
RatnerPrestia |
主权项 |
1. A method, which uses a solder transfer substrate manufactured by a manufacturing method that comprises:
an adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of dividing the adhesive layer into a first region and a second region and forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces, so that the solder powders are denser on the first region compared with the second region; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders, and a solder precoating method comprising: a solder joining step of superposing the solder transfer substrate and a work that has a layer with an electrode formed thereon so that a face on which the solder layer is formed faces a face on which the electrode is formed, and carrying out heating and pressurization, thereby allowing the solder powders on the first region to be diffused and joined to the electrode; and a transfer substrate peeling-off step of peeling off, after cooling, the solder transfer substrate from the work with the fillers being allowed to become initial points of the peeling-off, wherein a melting point of the fillers is higher than a melting point of the solder powders. |
地址 |
Osaka JP |