| 发明名称 | Chip package and method for forming the same | ||
| 摘要 | An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate. | ||
| 申请公布号 | US9030011(B2) | 申请公布日期 | 2015.05.12 |
| 申请号 | US201313959567 | 申请日期 | 2013.08.05 |
| 申请人 | Xintec Inc. | 发明人 | Lin Chao-Yen;Lin Yi-Hang |
| 分类号 | H01L23/00;H01L21/56;H01L21/683;H01L23/31;H01L23/525;H01L29/06 | 主分类号 | H01L23/00 |
| 代理机构 | Liu & Liu | 代理人 | Liu & Liu |
| 主权项 | 1. A chip package, comprising: a lower substrate; an upper substrate having an upper surface and a lower surface, disposed overlying the lower substrate; a recess adjacent to a sidewall of the upper substrate, wherein the recess is formed along a direction from the upper surface toward the lower surface of the upper substrate; a device region or sensing region located on the upper surface of the upper substrate; a conducting pad located on the upper surface of the upper substrate; and a conducting layer electrically connected to the conducting pad and extending to the recess along the sidewall of the upper substrate. | ||
| 地址 | Taoyuan TW | ||