Adhesion promoting composition for metal leadframes

摘要

A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.

主权项

1. An adhesion promoting composition useful in treating metal surfaces prior to bonding polymeric materials to the metal surfaces, the adhesion promoting composition comprising:
a) an oxidizer; b) an inorganic acid; c) a corrosion inhibitor; and d) an organic phosphonate selected from the group consisting of 1-hydroxy-1,1-ethylidene diphosphonate, amino tri(methylene-phosphonic acid), amino tri (methylene-phosphonic acid)pentasodium salt, 1-hydroxyethylene-1,1-diphosphonic acid, 1-hydroxyethylene-1,1-diphosphonic acid tetrasodium salt, ethylene diamine tetra(methylene phosphonic acid), ethylene diamine tetra(methylene phosphonic acid) pentasodium salt, hexamethylenediamine tetra(methylene phosphonic acid) potassium salt diethylenetriamine penta(methylene phosphonic acid), diethylenetriamine penta(methylenephosphonic acid) trisodium salt, diethylenetriamine penta (methylenephosphonic acid) pentasodium salt, diethlenetriamine penta(methylene phosphonic acid) pentasodium salt; bis-hexamethylene triaminepenta((methylenephoshonic acid) chloride salt, 2-phosphonobutane-1,2,4-tricarboxylic acid, tetrasodium salt of 1-hydroxy ethylidene (1,1-diphosphonic acid) and combination of one or more of the foregoing.