| 发明名称 | Non-isolating circuit assembly and lamp using the same | ||
| 摘要 | A non-isolating circuit assembly includes a heat sink, a circular supporting member, a thermal insulation pad, and a light emitter. The heat sink has an inwardly-shrank platform. The circular supporting member is disposed around the outer edge of the inwardly-shrank platform. The thermal insulation pad is disposed on the inwardly-shrank platform and the circular supporting member. The area of the thermal insulation pad is larger than that of the inwardly-shrank platform, and the circular supporting member supports the outer edge of the thermal insulation pad. The light emitter is disposed on the thermal insulation pad. | ||
| 申请公布号 | US9028103(B2) | 申请公布日期 | 2015.05.12 |
| 申请号 | US201213472372 | 申请日期 | 2012.05.15 |
| 申请人 | Edison Opto Corporation | 发明人 | Lee Hsuan-Hsien |
| 分类号 | F21V29/00;F21K99/00 | 主分类号 | F21V29/00 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A non-isolating circuit assembly comprising: a heat sink having an inwardly-reduced platform; a circular supporting member disposed around the outer edge of the inwardly-reduced platform, wherein the material of the circular supporting member comprises plastic; a thermal insulation pad disposed on the inwardly-reduced platform and the circular supporting member, wherein the area of the thermal insulation pad is larger than the area of the inwardly-reduced platform, and the circular supporting member supports the outer edge of thermal insulation pad; and a light emitter disposed on the thermal insulation pad. | ||
| 地址 | New Taipei TW | ||