发明名称 |
Method of manufacturing solid-state image sensor |
摘要 |
A method of manufacturing a solid-state image sensor having a pixel region and a peripheral circuit region, includes forming an oxide film on a semiconductor substrate, forming an insulating film on the oxide film, forming a first opening in the insulating film and the oxide film in the peripheral circuit region, forming a trench in the semiconductor substrate in the peripheral circuit region by etching the semiconductor substrate through the first opening using the insulating film as a mask, forming a second opening in the insulating film to penetrate through the insulating film in the pixel region and to reach a predetermined depth of the oxide film, and forming insulators in the trench and the second opening. |
申请公布号 |
US9029182(B2) |
申请公布日期 |
2015.05.12 |
申请号 |
US201314014716 |
申请日期 |
2013.08.30 |
申请人 |
Canon Kabushiki Kaisha |
发明人 |
Aoki Takeshi |
分类号 |
H01L31/18;H01L27/146;H01L21/762;H01L21/8234 |
主分类号 |
H01L31/18 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A method of manufacturing a solid-state image sensor having a pixel region and a peripheral circuit region, comprising:
forming an oxide film on a semiconductor substrate; forming an insulating film on the oxide film; forming a first opening in the insulating film and the oxide film in the peripheral circuit region; forming a trench in the semiconductor substrate in the peripheral circuit region by etching the semiconductor substrate through the first opening using the insulating film as a mask; forming a second opening in the insulating film to penetrate through the insulating film in the pixel region and not to penetrate through the oxide film; and forming insulators in the trench and in the second opening after the forming of the trench and the forming of the second opening. |
地址 |
Tokyo JP |