发明名称 Method of manufacturing solid-state image sensor
摘要 A method of manufacturing a solid-state image sensor having a pixel region and a peripheral circuit region, includes forming an oxide film on a semiconductor substrate, forming an insulating film on the oxide film, forming a first opening in the insulating film and the oxide film in the peripheral circuit region, forming a trench in the semiconductor substrate in the peripheral circuit region by etching the semiconductor substrate through the first opening using the insulating film as a mask, forming a second opening in the insulating film to penetrate through the insulating film in the pixel region and to reach a predetermined depth of the oxide film, and forming insulators in the trench and the second opening.
申请公布号 US9029182(B2) 申请公布日期 2015.05.12
申请号 US201314014716 申请日期 2013.08.30
申请人 Canon Kabushiki Kaisha 发明人 Aoki Takeshi
分类号 H01L31/18;H01L27/146;H01L21/762;H01L21/8234 主分类号 H01L31/18
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A method of manufacturing a solid-state image sensor having a pixel region and a peripheral circuit region, comprising: forming an oxide film on a semiconductor substrate; forming an insulating film on the oxide film; forming a first opening in the insulating film and the oxide film in the peripheral circuit region; forming a trench in the semiconductor substrate in the peripheral circuit region by etching the semiconductor substrate through the first opening using the insulating film as a mask; forming a second opening in the insulating film to penetrate through the insulating film in the pixel region and not to penetrate through the oxide film; and forming insulators in the trench and in the second opening after the forming of the trench and the forming of the second opening.
地址 Tokyo JP