| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package which shields electromagnetic noise from a peripheral environment and meets demands for weight saving of an integrated circuit module, and to provide a manufacturing method of the electronic component package.SOLUTION: An electronic component package 100 includes: a substrate 101 having at least one electronic circuit; a sealing resin 110 which seals the electronic circuit, the sealing resin 110 filled with at least one filler 111 in which at least one crack 112 is formed; and a metal film 120 which is formed on an upper surface of the sealing resin 110 and has a root part buried in the crack 112 of the filler 111. |
