| 摘要 |
A semiconductor package according to an embodiment of the present invention comprises: a first semiconductor package including a first semiconductor chip, and a first substrate where the first semiconductor chip is mounted, and a via hole is formed in a peripheral area of the first semiconductor chip; a second semiconductor package including a second semiconductor chip, and a second substrate where the second semiconductor chip is mounted, a through hole is formed in a peripheral area of the second semiconductor chip, and a connection member extended on the second substrate, and connected with the first substrate; and a conductive member filled in the through hole of the second substrate, and electrically connected with the first upper wiring pattern formed on an upper surface of the first substrate as extended to the outside of the second substrate. The second substrate and the connection member can be provided with a conductive material. |
