SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A method of manufacturing a semiconductor package includes: forming a strip substrate including a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines, first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad over the respective unit substrates, second ground connection pads formed on the saw line on the first surface side of the unit substrates and electrically isolated from the unit substrates, and test wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates.

主权项

1. A method of manufacturing a semiconductor package, comprising the steps of:
forming a strip substrate including:
a plurality of unit substrates, each being provided with a first connection pad and a second connection pad on a first surface of the unit substrate and each unit substrate being electrically and physically isolated from each other with the intervention of saw lines,first ground connection pads formed on the respective unit substrates, each of the first ground connection pads being electrically coupled with the first connection pad,second ground connection pads formed on the saw line and electrically isolated from the unit substrates, andtest wiring formed on the saw line, the test wiring being electrically isolated from the unit substrates and electrically coupled with the second ground connection pads; and attaching semiconductor chips onto the respective unit substrates; forming first conductive wires that electrically connect the first ground connection pads and the second ground connection pads; forming second conductive wires that electrically connect the first connection pads of the unit substrates and the first bonding pads of the semiconductor chips; and forming third conductive wires that electrically connect the second connection pads of the unit substrates and the second bonding pads of the semiconductor chips.