| 发明名称 |
PRINTHEAD INCLUDING INTEGRATED CIRCUIT DIE COOLING |
| 摘要 |
One example provides a printhead including a substrate and a fluidics structure attached to the substrate. The fluidics structure includes actuators for ejecting ink from the printhead. The printhead includes an integrated circuit die attached to the substrate. The integrated circuit die is for driving the actuators. The integrated circuit die is cooled by a coolant contacting the integrated circuit die and flowing through the substrate. |
| 申请公布号 |
US2015124019(A1) |
申请公布日期 |
2015.05.07 |
| 申请号 |
US201214397569 |
申请日期 |
2012.07.30 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
Cruz-Uribe Tony S.;Clark James Edward |
| 分类号 |
B41J2/14 |
主分类号 |
B41J2/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printhead comprising:
a substrate; a fluidics structure attached to the substrate, the fluidics structure comprising actuators for ejecting ink from the printhead; and an integrated circuit die attached to the substrate, the integrated circuit die for driving the actuators, the integrated circuit die cooled by a coolant contacting the integrated circuit die and flowing through the substrate. |
| 地址 |
Fort Collins CO US |
