LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface, The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

主权项

1. A method of manufacturing a light emitting diode package base comprising:
providing a metal core substrate having a top surface and a bottom surface; forming two first trenches in the metal core substrate, the first trenches extending from the top surface to the bottom surface; at least partially filling the first trenches with first dielectric material to form dielectric isolations, the dielectric isolations dividing the metal core substrate into three metal core portions, two of the metal core portions configured to serve as light emitting diode package electrodes; applying a second dielectric material to cover at least a portion of the first dielectric material; and forming a conductive layer over the second dielectric material to form circuit contacts, the conductive layer including a first conductive material.