| 发明名称 |
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE |
| 摘要 |
This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module. |
| 申请公布号 |
US2015124411(A1) |
申请公布日期 |
2015.05.07 |
| 申请号 |
US201414580257 |
申请日期 |
2014.12.23 |
| 申请人 |
Iihola Antti;Jokela Timo |
发明人 |
Iihola Antti;Jokela Timo |
| 分类号 |
H05K1/18;H05K3/10;H05K3/32;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic module, comprising:
a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a second conductive pattern layer embedded between the first and second insulating material layers. |
| 地址 |
Helsinki FI |
