| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic-substrate-lead cutting device capable of automatically cutting a lead on a rear surface of an electronic substrate to a height equal to or smaller than a predetermined value only by mounting the electronic substrate on the electronic-substrate-lead cutting device.SOLUTION: After cutting a lead 400, a cutting blade 220 operates to retreat from an electronic substrate 100 with a cutting edge of the cutting blade 220 kept closed, thereby making it possible to forcibly cut off a remainder of the lead 400. That is, a cutting-blade drive actuator 227 starts to drive a nipper (cutting blade) drive cam 210 to operate in response to starting of the actuator 227, whereby the nipper blade 220 is closed and cuts the lead 400. Next, a rotation actuator 230 starts to drive an upper nipper portion to rotate with a cam follower going through the cam, and the nipper blade 220 cuts off the lead 400 with the nipper blade 220 kept closed.</p> |
