| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating apparatus capable of controlling plating thickness variation resulting from a density difference in a circuit pattern and substrate in-plane variation resulting from the apparatus, simultaneously by a simple method at a low cost, enabling a homogeneous pattern plating film.SOLUTION: A plating apparatus includes: a plating tank (001) storing plating solution; a cathode of an external power source electrically connected to a substrate (008) that is a plating target article immersed in the plating solution; two anode parts (005) opposingly arranged on front and back surfaces of the substrate, respectively, and electrically connected to an anode of the external power source; and an electroconductive auxiliary cathode (0009) arranged between the substrate and at least one of the anode part while facing the substrate surface in parallel and electrically connected to the cathode side of the external power source. The electroconductive auxiliary cathode (009) has a plurality of openings.</p> |
