| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily manufacture a device with a protective cover without breaking a protective cover wafer. <P>SOLUTION: A groove 22 is formed on the region of the protective cover wafer 2 corresponding to a bonding pad 13, the center of a rear face thereof is ground to form a recessed part to be made into a state of being surrounded with an annular protruded part. The device forming face of a device wafer 1 is stuck to the groove forming face of the protective cover by making the groove 22 correspond to the bonding pad 13 of the device wafer 1. The protective cover wafer 2 is cut along the groove 22 to expose the bonding pad 13, the device wafer 1 is split along a split-scheduled line 11, and the device with the protective cover is manufactured. Troublesomeness of management of an etchant can be canceled since no etching is performed. By enhancing the strength by forming the annular protruded part to the protective cover wafer 2, the breakage of the protective cover wafer 2 is prevented to make the protective cover wafer 2 thin. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
