| 发明名称 |
Catalyst solution for electroless plating and method for electroless plating |
| 摘要 |
<p>The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.</p> |
| 申请公布号 |
EP2868771(A1) |
申请公布日期 |
2015.05.06 |
| 申请号 |
EP20140190993 |
申请日期 |
2014.10.30 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
OKADA, HIROKI;SHENGHUA, LI;HAYASHI, SHINJIRO |
| 分类号 |
C23C18/30 |
主分类号 |
C23C18/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
