发明名称 Mold thickness adjusting apparatus of injection molding machine
摘要 An injection molding machine is provided with an automatic mold thickness adjusting apparatus. The amount of compensation of the position of a rear platen that is adjusted at the time of installation of a mold is determined by calculating the thermal expansion of the mold that is expected to occur at the completion of a rise in temperature based on the difference in temperature between the mold temperature at the time of mold thickness adjustment and the mold temperature at the time of injection molding. Then, the rear platen is moved to the compensated position thus determined.
申请公布号 US9022767(B2) 申请公布日期 2015.05.05
申请号 US201314075179 申请日期 2013.11.08
申请人 Fanuc Corporation 发明人 Oono Hajime;Yoshioka Mitsushi
分类号 B29C45/76;B29C45/17 主分类号 B29C45/76
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. A mold thickness adjusting apparatus of an injection molding machine, wherein the injection molding machine includes a fixed platen to which a fixed-side mold is attached,a rear platen coupled to the fixed platen via a plurality of tie bars,a clamping mechanism provided in the rear platen, anda movable platen which is arranged so as to move forward and backward along the tie bars by means of the clamping mechanism and to which a movable-side mold is attached, and the mold thickness adjusting apparatus is configured to perform a mold thickness adjustment by adjusting a space between the fixed platen and the rear platen, and includes a mold temperature setting unit configured to set a temperature of any one of the fixed-side mold and the movable-side mold or both at a time of molding,a mold temperature obtaining unit configured to obtain a temperature of any one of the fixed-side mold and the movable-side mold or both at a time of mold thickness adjustment,a temperature difference calculating unit configured to calculate a difference in temperature between the temperature set by the mold temperature setting unit and the temperature obtained by the mold temperature obtaining unit,a mold thermal expansion amount calculating unit configured to calculate amounts of thermal expansion of the fixed-side mold and the movable-side mold from the difference in temperature,a rear platen position determination unit configured to determine a position of the rear platen to generate a set clamping force at an ambient temperature at the time of mold thickness adjustment,a rear platen position compensation unit configured to determine a compensated rear platen position by adding the amounts of thermal expansion of the fixed-side mold and the movable-side mold to the position of the rear platen thus determined, anda rear platen moving unit configured to move the rear platen to the compensated rear platen position thus determined.
地址 Yamanashi JP