Wire fence fingerprint sensor package and fabrication method

摘要

A wire fence fingerprint sensor package includes a substrate, a fingerprint sensor mounted to the substrate, and a wire fence mounted to the substrate adjacent the fingerprint sensor. During use, the wire fence is electrically connected to a reference voltage source, e.g., ground. Thus, the wire fence discharges electrostatic discharge (ESD) from a finger contacting the wire fence fingerprint sensor package. The wire fence is formed of low cost wire loops that are fabricated, for example, using a standard and inexpensive wire bonding apparatus. Accordingly, the wire fence fingerprint sensor package is fabricated at a minimal cost.

主权项

1. A structure comprising:
a package substrate comprising a first substrate surface and a second substrate surface opposite the first substrate surface; a fingerprint sensor die comprising a first die surface, a second die surface opposite the first die surface, and a plurality of side die surfaces connecting the first die surface and the second die surface, wherein the second die surface is coupled to the first substrate surface; and a wire fence separate from the fingerprint sensor die and coupled to the first substrate surface at a position adjacent to at least one of the plurality of side die surfaces, where the wire fence provides electrostatic discharge protection for the fingerprint sensor die.