Metallization for a cavity housing and a nonmagnetic sealed cavity housing

摘要

The invention relates to a metallization for a housing, for example for surface wave components, for use in strong magnetic fields as well as a nonmagnetic hermetically sealed cavity housing.

主权项

1. A metallization layer for a ceramic, comprising:
a base layer comprising a metal, an adhesion layer proximate to the base layer, wherein the adhesion layer comprises palladium and the layer thickness of the adhesion layer is between 0.1 and 5.0 μm, a solderable layer proximate the adhesion layer made of a non-ferromagnetic material, wherein the material of the adhesion layer is different from the material of the solderable layer, and an oxidation protection layer arranged over the solderable layer,wherein the base layer comprises a metal with a melting point of at least 1100° C. and, whereinthe base layer is made of tungsten/molybdenum and the base layer has a layer thickness between 5 and 20 μm;the solderable layer is made of copper and the solderable layer has a layer thickness between 2 and 15 μm; and
an additional layer is arranged between the solderable layer and the oxidation protection layer and is made of palladium and the additional layer has a layer thickness between 0.5 and 3.0 μm.